Hiring: Substrate Process Engineer Company: Atomica Location: Goleta, CA Job Posted Time: 2026-09-16 11:06:07 Target Skills & Keywords : Foundry, R, Root Cause Analysis About the job Experience: •3+ years experience in semiconductor or MEMS fabrication Required Skills: •Develop and maintain wafer bonding processes (eutectic, thermocompression, direct, adhesive). •Wet etch processes (Si, oxide, metals) including rate and uniformity control. •Support electroplating processes (Au, Cu, Ni, NiFe, AuSn). •Support Dicing, CMP , wafer Grinding processes. •Improve yield, reduce defects, and optimize process stability. •Perform DOE, root cause analysis, and SPC monitoring. •Support equipment qualification and uptime. •Work closely with R&D, production, and quality teams. Qualifications: •B.S. or M.S. in Engineering (Materials, Chemical, Electrical, Mechanical, or related) Compensation: •$90,000 - $140,000 / year Interested candidates, please apply directly through the job posting on company's career page or try via AI auto apply on this platform. Don't miss this opportunity to join a forward-thinking team!