Hiring: Sr. Hardware Engineering Manager Company: Hyve Solutions Location: Greater Bend Area Job Posted Time: 2026-09-10 12:14:17 Target Skills & Keywords : Agile, Firmware, Program Management, Risk Management, Systems Design, Systems Integration About the job Experience: •3 years directly managing hardware engineers with hiring and performance responsibility, and proven delivery of server, GPU, or accelerator platforms into high-volume production. •At least 3 years directly managing hardware engineers with hiring and performance responsibility, and proven delivery of server, GPU, or accelerator platforms into high-volume production. Required Skills: •Team leadership. Manage and grow a team of board design, SI/PI, thermal, power delivery, and firmware engineers across Fremont and Portland, owning hiring, onboarding, coaching, and performance development for direct reports. •Program execution. Drive delivery of GPU and compute server platform programs from architecture through EVT, DVT, PVT, and mass production, managing schedule, resource loading, quality, and cross-functional dependencies. •Technical oversight. Provide hands-on technical direction across schematic, layout, SI/PI, thermal, power, and firmware deliverables, guiding design trade-offs and leading complex root-cause debug across hardware, firmware, and system integration. •Design review discipline. Run design reviews and quality gates against Hyve's board design review framework (DR0.1 through DR1.0), and drive measurable improvement in first-pass success, yield, and time to market. •Customer engagement. Act as a primary engineering point of contact for Hyperscaler counterparts on assigned platforms, communicating technical status, risks, and commitments clearly and early. •Cross-geo collaboration. Partner closely with Taiwan design, operations, manufacturing, and validation teams so that designs are globally aligned, manufacturable, and scalable. •Production ramp support. Work with Operations, Manufacturing, and Quality to scale from prototype to high-volume production, and support datacenter deployment with rapid issue triage and corrective action. •Technical breadth: Working command of board design, high-speed interfaces (PCIe Gen5/Gen6, CXL, NVLink, Ethernet), power delivery networks, thermal design for both air and liquid cooling, and platform firmware, with the judgment to arbitrate trade-offs across those disciplines. Qualifications: •Direct experience supporting Hyperscalers or large cloud providers in an ODM or JDM model. •Operational familiarity with liquid-cooled AI system design and rack-level integration. •Paid Holidays, Vacation & Sick Days Compensation: •$162,000 - $220,000 / year Interested candidates, please apply directly through the job posting on company's career page or try via AI auto apply on this platform. Don't miss this opportunity to join a forward-thinking team!