Hiring: Senior Process and Integration Engineer Company: Keysight Technologies Location: Santa Rosa, CA Job Posted Time: 2026-09-16 10:27:41 Employment Type: Hybrid Target Skills & Keywords : Assembly, CAD, R About the job Experience: •8+ years of relevant hands-on experience in microelectronics, microcircuit assembly, semiconductor packaging, or precision manufacturing process development. Required Skills: •Serve as the subject matter expert (SME) and technical lead for microcircuit assembly processes - epoxy dispensing, gold-gold thermoscopic bonding (wire bonding, ball bonding, stud bumping, flip chip), automatic placement, soldering, silver sintering, and plasma cleaning - providing technical direction across R&D, Manufacturing, and Quality. •Act as the process team's technical lead on New Product Introduction (NPI) programs, representing process engineering in design reviews, program reviews, and cross-functional decision forums. •Lead Design for Manufacturability (DFM) reviews and formal risk assessments (e.g., FMEA) for new products and process changes; identify and drive mitigation of manufacturability and yield risks ahead of production. •Influence product and package design decisions upstream by advising R&D and design teams on manufacturability, process capability, and assembly constraints. •Make strategic technical decisions that affect build schedule, capacity, and production readiness, weighing risk, cost, and timeline trade-offs. •Lead process development projects end to end: define scope and technical approach, plan resources and schedule, and drive execution to qualified, production-ready processes. •Own qualification of new equipment, materials, and processes; drive continuous improvement in yield, capability, and efficiency across the group's core assembly processes. •Contribute to and help shape the department's technology roadmap by evaluating emerging assembly technologies and recommending strategic capability investments. Qualifications: •Master's or Ph.D. in Materials Science, Chemical Engineering, Mechanical Engineering, Manufacturing Engineering, Electrical Engineering, Physics, or a related engineering discipline preferred. Candidates with a Bachelor's degree and significant directly related experience will also be considered. •Demonstrated experience leading process development projects and/or serving as the technical point of contact on NPI programs. •Hands-on depth in one or more of the following: epoxy dispensing, wire bonding, ball bonding, gold stud bump and flip chip bonding, automatic placement, silver sintering, or soldering. •Proven track record applying DOE, statistical analysis, and root cause methodologies to resolve complex process and yield problems. •Strong written and verbal communication skills, including presenting technical recommendations to management and cross-functional leadership. •Demonstrated capacity to work in a hands-on laboratory and production floor environment. •ITAR clearance (U.S. person status) required. •Ph.D. or Master's degree in Materials Science, Chemical Engineering, or related engineering disciplines •Advanced knowledge of high frequency interconnect and connectorization for RF applications •Advanced knowledge of DFM, DOE, statistical process control (SPC), and root cause analysis methodologies. Interested candidates, please apply directly through the job posting on company's career page or try via AI auto apply on this platform. Don't miss this opportunity to join a forward-thinking team!