Hiring: Research Scientist – RF/Mixed-Signal Packaging and Module Design Company: IBM Location: Yorktown Heights, NY Job Posted Time: 2026-09-12 07:40:09 Employment Type: Hybrid About the job Experience: •RF and/or digital IC design experience is a plus •Programming Skills: Candidates with strong programming skills in commonly used languages •Communication and collaboration skills: Excellent verbal and written communication skills are highly valued for effective collaboration within the team. A track record of successful participation in multi-disciplinary research and development projects is a plus. •Research skills: Proven record of research accomplishment (e.g. publications) Qualifications: •Doctorate Degree •Required Technical And Professional Expertise •Strong background in RF/microwave engineering. •Operational familiarity with state-of-the art packaging technologies. •RF/Mixed-Signal Package Design: A strong foundation and experience in package physical design, EM simulation, and SI/PI. (2 years). •Module implementation: Demonstrated expertise through successful implementation of RF, analog, and/or mixed-signal packaging solutions including experimental characterization (2 years). Interested candidates, please apply directly through the job posting on company's career page or try via AI auto apply on this platform. Don't miss this opportunity to join a forward-thinking team!