Hiring: R&D Engineer 2, Hardware Company: Keysight Technologies Location: Colorado Springs, CO Job Posted Time: 2026-09-11 10:27:41 Target Skills & Keywords : ASIC, Assembly, PCB, R About the job Required Skills: •ASIC package development for RF and high-speed digital applications •Development of electrical models to optimize the IC, package, and system interconnect performance •Package substrate design, layout, and documentation •Close collaboration with IC design and test teams to understand and influence requirements, functionality, and performance •Identification of appropriate packaging technology solutions for each chip design •Product-level support to enable hardware development and integration of critical ASIC blocks •Investigation of next generation technologies •Collaboration with supply chain partners throughout the ASIC development cycle Qualifications: •Bachelors or Masters of Science in Electrical Engineering with minimum 3.5 GPA •Excellent understanding and application of Electrical Engineering fundamentals •Excellent understanding and experience in RF/microwave theory and circuit design •Excellent understanding and some experience in hardware design •Familiarity/experience with hardware design tools •Operational familiarity with IC packaging technologies preferred Interested candidates, please apply directly through the job posting on company's career page or try via AI auto apply on this platform. Don't miss this opportunity to join a forward-thinking team!