Hiring: Quantum NCG 3DHI Engineer Company: GlobalFoundries Location: Essex, NY Job Posted Time: 2026-09-12 13:02:19 Employment Type: Full-time Target Skills & Keywords : Assembly, Foundry, Project Management, R About the job Required Skills: •Drive 3DHI process development efforts and planning by working with the unit process engineers and directly with the tools & materials suppliers for the Quantum Advanced Packaging projects. •Partner cross-functionally with OSATs (Outsourced Assembly and Test) to develop new wafer level and die level 2.5D and 3D Heterogeneous Integration processes. •Develop expertise in the processes, materials and tooling leveraging available characterization resources. •Drive a mechanistic understanding of failure modes. •Develop integration schemes to continuously improve yields and to reduce cycle time & costs. •Generate IP related to novel wafer integration & packaging technology. •Work and collaborate with other teams regarding different assignments as needed. •Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs. Qualifications: •Prior related internship or co-op experience. •Language Fluency - English (Written & Verbal). •Fundamental knowledge of semiconductor packaging process modules and integration. •Demonstrated prior leadership experience in the workplace, school projects, competitions, etc. •Project management skills, i.e., the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity. •Strong written and verbal communication skills. •Strong planning and organizational skills. Compensation: •$85,000 - $146,000 / year Interested candidates, please apply directly through the job posting on company's career page or try via AI auto apply on this platform. Don't miss this opportunity to join a forward-thinking team!