Hiring: Program Manager/Engineer | Embedded Processing Company: Texas Instruments Location: Sugar Land, TX Job Posted Time: 2026-09-16 20:39:30 Target Skills & Keywords : Assembly, Embedded Systems, Firmware, Program Management About the job Experience: •2+ years of engineering experience with project engineering/management experience on highly complex products/projects Required Skills: •Change the world. Love your job. •The ASM BU develops advanced microcontroller solutions for safety-critical applications, with a primary focus on automotive and industrial markets. Our portfolio includes high-performance MCUs designed for ADAS, body electronics, powertrain control, industrial automation, and motor control applications. •Lead a cross functional team on the execution of releasing new products and ensuring successful return on investment for every development; the team consists of Design, Marketing, Systems & Applications, Validation, Product & Test Engineering, Firmware/Software Engineering, Manufacturing, Field, and Quality •Interface directly with wafer fabrication, assembly & test sites to guarantee schedule, cost and quality •Plan the project using MS Project from Assess Opportunity Phase to Release to Market and is responsible to make sure the project comes in on budget •Provide clear direction to both, team and external support organizations like device fabrication and assembly and test sites •Drive and motivate all team members critical to the flawless execution of each product and project •Provide weekly and monthly updates to senior management on status of projects, explaining the issues facing a project Qualifications: •Bachelors degree in Electrical Engineering, ECE, Computer Engineering, Mechanical Engineering or related engineering degree •Proven leadership capabilities in leading multifaceted global organizations •Successful proven track record in indirect management and influence •Demonstrated capacity to manage multiple projects simultaneously, and set realistic plans based on required tasks with available resources •Demonstrated capacity to effectively coordinate and lead global development teams on projects that include design, silicon fabrications, production test development, qualification and production ramp; Programs will be driven out of multiple global locations •Demonstrated capacity to provide clear direction to both internal teams and external support organizations like device fabrication and assembly sites •Knowledge of device packaging and wafer fabrication process •Knowledge of reliability requirements and tri-temp characterization methodology using statistical analysis •Demonstrated capacity to work in a team environment and understand cross-functional team dynamics •Demonstrated capacity to work with global customers to align project schedules with customers' key milestones Compensation: •$90,500 - $145,000 / year Interested candidates, please apply directly through the job posting on company's career page or try via AI auto apply on this platform. Don't miss this opportunity to join a forward-thinking team!