Hiring: Process integration and Defect Reduction Engineer Company: Intel Location: Albuquerque, NM Job Posted Time: 2026-09-13 02:23:52 Employment Type: On-site Target Skills & Keywords : Compliance, SQL About the job Experience: •3+ years of experience in the semiconductor industry. •3+ years of experience in process integration or defect reduction for backend interconnect or advanced packaging processes. •3+ years of experience applying Design of Experiments (DOE) methodologies. •3+ years of experience in data analysis and statistical process control using tools such as JMP, SQL, PCS, or similar platforms. Required Skills: •The New Mexico Silicon Manufacturing (NM Si Mfg) Yield Department is seeking Process Integration and Defect Reduction Engineers to support backend interconnect and advanced packaging semiconductor fabrication. These roles support Fab 11X, with a focus on Intel's Foveros and EMIB technologies. •Desired Skills And Behavioral Traits •The ideal candidate will demonstrate: •Strong teamwork, leadership, problem-solving, and prioritization skills in a high-performance environment. •Excellent written and verbal communication skills. •The ability to present technical information clearly and effectively to audiences with varying levels of technical expertise. •The ability to work independently with minimal supervision while effectively managing multiple priorities. •Experience leading factory-level projects and delivering results in a timely manner. Qualifications: •Bachelor's or Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, Materials Science, Microelectronics Engineering, Chemistry, Physics, or a related technical field. •3+ years of experience in the semiconductor industry. •This position is not eligible for Intel immigration sponsorship. •3+ years of experience in process integration or defect reduction for backend interconnect or advanced packaging processes. •3+ years of experience applying Design of Experiments (DOE) methodologies. •3+ years of experience in data analysis and statistical process control using tools such as JMP, SQL, PCS, or similar platforms. •In-depth knowledge of semiconductor manufacturing process flow and advanced packaging technologies. •Knowledge of process capability, specification limits, statistical variation, and process control methodologies. •Shift 1 (United States of America) Interested candidates, please apply directly through the job posting on company's career page or try via AI auto apply on this platform. Don't miss this opportunity to join a forward-thinking team!