Hiring: Principal Microelectro Packaging Engineer Company: Starkey Hearing Location: Eden Prairie, MN Job Posted Time: 2026-09-10 10:27:41 Target Skills & Keywords : Assembly, Embedded Systems, PCB About the job Experience: •Multi-layer microelectronic packaging and PCB assembly design, process development, and manufacturing. •Reliability testing and failure analysis of microelectronic packages and assemblies. •Semiconductor wafer fabrication and backend processing including RDL, thinning, bumping, assembly, and testing. •PCB design and PCBA layout using ECAD tools. •Schematic capture review and electronic hardware design support. Required Skills: •This position will drive miniaturization and optimization of microelectronic packaging and assemblies by investigating new processes, packaging technologies, and advanced materials/sets. •The Principal Microelectronic Packaging Engineer will lead concept design, guide Mechanical Engineers, Electrical Engineers and ECAD Designers as part of a multi-functional advanced technology development team to create new and innovative ideas for microelectronic circuits, assemblies, and packaging. Qualifications: •At least a 4-year college degree (M.S. or Ph.D. degree preferred) in engineering or a physical science with a strong emphasis in metrology, materials science, electrical engineering, chemical engineering, physical analysis, and chemical analysis •The successful candidate shall possess expert-level knowledge and demonstrated experience in the design, development, manufacturing, qualification, and reliability assessment of advanced microelectronic packaging technologies. •Multi-layer PCB and microelectronic packaging design, manufacturing, assembly, and verification processes. •Rigid and flexible PCB technologies and advanced PCB design, manufacturing, and assembly processes. •Wafer backend processes such as redistribution layer (RDL), wafer thinning, bumping, assembly, and test methodologies. •Electronic packaging design reviews, schematic capture review, and PCB/PCBA layout practices. •Statistical process control, design of experiments, root-cause investigation, and process optimization methodologies. •Package and interconnect reliability characterization. •Solder joint and assembly reliability evaluation. •Environmental and accelerated life testing. Compensation: •$137,000 - $186,900 / year •This position is eligible for a bonus based upon performance results Interested candidates, please apply directly through the job posting on company's career page or try via AI auto apply on this platform. Don't miss this opportunity to join a forward-thinking team!