Hiring: Principal Engineer, IO Design Company: Micron Technology Location: Boise, ID Job Posted Time: 2026-09-13 17:56:15 Employment Type: Full-time, On-site Target Skills & Keywords: IO Design, Principal Engineer, Semiconductor, Memory, Circuit Design, Analog/Mixed-Signal, High-Speed Interfaces, DDR, LPDDR, GDDR, HBM, SerDes, PHY, CMOS, FinFET, Cadence, Synopsys, HSPICE, Spectre, Silicon Validation, RTL, Verilog, SystemVerilog, Scripting, Python, Perl, Tcl, Team Leadership, Mentorship, Innovation, Problem Solving, Cross-functional Collaboration Experience: - Extensive experience in IO design for high-speed memory interfaces (e.g., DDR, LPDDR, GDDR, HBM) - Proven track record of leading complex circuit design projects from concept to production - Experience with advanced CMOS process nodes (e.g., FinFET) - Demonstrated ability to mentor and lead teams of engineers Required Skills: - Deep understanding of analog and mixed-signal circuit design principles - Expertise in designing high-speed IO circuits, including drivers, receivers, and clocking schemes - Proficiency with EDA tools for circuit design and simulation (e.g., Cadence Virtuoso, Synopsys HSPICE, Spectre) - Strong knowledge of signal integrity and power integrity concepts - Experience with silicon bring-up, debug, and validation - Ability to work collaboratively with cross-functional teams (e.g., layout, systems, product engineering) Qualifications: - Bachelor's degree in Electrical Engineering, Computer Engineering, or a related field; Master's or PhD preferred - 10+ years of relevant industry experience in IO or high-speed circuit design - Strong analytical and problem-solving skills - Excellent communication and leadership abilities Compensation: - Not specified in the job posting Interested candidates, please apply directly through the job posting on company's career page or try via AI auto apply on this platform. Don’t miss this opportunity to join a forward-thinking team!