Hiring: Principal 3D-heterogeneous integration engineer Company: GlobalFoundries Location: Essex, NY Job Posted Time: 2026-09-11 13:02:19 Employment Type: Hybrid Target Skills & Keywords : Assembly, Foundry, Project Management, R About the job Experience: •5 years of prior related work experience. •3 years of prior related work experience. Required Skills: •Drive 3D-HI process development efforts for the building blocks required for advanced packaging solutions needed by the GlobalFoundries product lines (e.g., multi-die stacking, die-to-wafer / wafer-to-wafer fine pitch hybrid bonding, etc.). •Partner with unit process engineers, manufacturing engineers, as well as directly with the tool and material vendors for the GlobalFoundries fabs. •Collaborate joint development projects (JDP) with partners to develop new wafer level and die level 2.5D and 3D Heterogeneous Integration (3D-HI) processes. •Drive end-to-end process integration and planning to enable new capabilities and early product prototyping across multiple programs. •Develop expertise in processes, materials, and tooling, and make efficient use of characterization resources. •Drive data analysis, interpretation of results, and understanding of failure modes. •Identify and resolve process integration issues and related challenges. •Generate IP related to novel wafer integration and packaging technology. Qualifications: •MS degree with at least 4~5 years of prior related work experience. •In depth knowledge of BEOL processes and integration (advanced bonding, TSVs), bump/wafer finish integration, wafer test/probe, OSAT collaboration, and package development & assembly. •Strong problem solving and technical trouble shooting skills including expertise in design of experiment. •Language Fluency - English (Written & Verbal). •Demonstrated prior leadership experience internally or with an OSAT eco-system. •Project management skills, i.e. the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity. •Strong written and verbal communication skills. •Strong planning and organizational skills. Compensation: •$85,000 - $146,000 / year Interested candidates, please apply directly through the job posting on company's career page or try via AI auto apply on this platform. Don't miss this opportunity to join a forward-thinking team!