Hiring: Packaging Equipment Development Group Lead Company: Intel Location: Phoenix, AZ Job Posted Time: 2026-09-12 02:23:52 Employment Type: On-site Target Skills & Keywords : Assembly, Compliance, Kind, Phoenix About the job Experience: •9+ years of relevant experience. •6+ years of relevant experience. •4+ years of relevant experience. •5+ years of semiconductor assembly process technology development experience. •3+ years of people management experience, including mentoring and team leadership. Required Skills: •Lead a team responsible for equipment development, driving innovative solutions for semiconductor packaging. •Drive first of kind equipment introduction, development and ensure smooth transitions between development and high-volume manufacturing (HVM). •Manage strategic and tactical decision-making for module engineering activities, ensuring alignment with Intel's operational goals. •Partner cross-functionally with internal and external stakeholders, including manufacturing, automation, equipment suppliers, and process integration teams, to optimize equipment, processes and solve technical challenges. •Develop long-term strategies for equipment capabilities to support future requirements. •Provide mentorship to engineers, fostering technical expertise and leadership within the team. •Ensure team accountability and drive results through effective goal setting, performance management, and collaboration. •Champion Intel's values, creating an inclusive and productive work environment. Qualifications: •Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. •Bachelor's degree in Materials Science, Mechanical Engineering, Physics, Electrical Engineering, Chemical Engineering or a related field, with 9+ years of relevant experience. •OR- Master's degree in the above fields with 6+ years of relevant experience. •OR- PhD degree in the above fields with 4+ years of relevant experience. •Demonstrated experience in equipment development and process integration for semiconductor packaging. •Proficiency in statistical methods, experimental design, and data analysis. •5+ years of semiconductor assembly process technology development experience. •3+ years of people management experience, including mentoring and team leadership. •Expertise in dispense, thermal, plasma equipment development, or related fields. •Strong problem-solving skills and familiarity with assembly equipment development methodologies. Interested candidates, please apply directly through the job posting on company's career page or try via AI auto apply on this platform. Don't miss this opportunity to join a forward-thinking team!