Hiring: Field Application Engineer (some DFM experience required) Company: Thintronics Location: Alameda, CA Job Posted Time: 2026-09-03 10:44:36 Target Skills & Keywords : Assembly, Embedded Systems, PCB, R, SAP About the job Experience: •5+ years of experience in IC packaging, advanced substrates, high-density PCB fabrication, applications engineering, or a closely related field. Required Skills: •Thintronics is seeking a hands-on •To serve as the technical bridge between our customers, substrate manufacturing partners, OSATs, and internal engineering, business development, sales, and marketing teams. •Be a driving force behind successful customer builds, from substrate-like PCBs and FCBGA build-up substrates to interposers and redistribution layer (RDL) structures, ensuring projects are executed on time and to specification. •Customer Engagement & Technical Collateral Management •Partner closely with Business Development, Sales, and Marketing to support customer engagements from initial technical discussions through successful project completion. •Collect, review, and manage technical collateral from customers, including layout databases (e.g., Cadence APD design files), Gerber, ODB++, and IPC-2581 outputs, netlists, and assembly drawings. •Serve as a primary technical point of contact for customers on substrate design, manufacturability, material integration, and build status. •Translate customer requirements and manufacturing feedback into actionable technical requirements for Thintronics' internal teams. Qualifications: •Bachelor's degree in Electrical Engineering, Materials Science, Mechanical Engineering, or a related technical field. •Solid functional working knowledge of mSAP, SAP, and/or Embedded Trench substrate manufacturing processes. •Hands-on familiarity with advanced packaging form factors, including SLP, FCBGA build-up substrates, interposers, and RDL structures. •Operational familiarity with at least one package/PCB layout tool, such as Cadence APD/Allegro or Siemens Xpedition Package Designer, and/or CAM tools such as CAM350. •Demonstrated ability to perform DFM/DRC reviews and substrate stack-up analyses. •Strong project coordination and task-tracking skills, with the ability to manage customers, fabricators, and assembly partners simultaneously. •Strong written and verbal communication skills and the ability to communicate effectively with both highly technical and commercial audiences. •Willingness to travel to customer and partner sites as needed, domestically and internationally. •This is an individual contributor role; prior people-management experience is not required. •Master's degree in a relevant engineering discipline. Compensation: •$124,000 - $158,000 / year •Comprehensive medical, dental, and vision insurance Interested candidates, please apply directly through the job posting on company's career page or try via AI auto apply on this platform. Don't miss this opportunity to join a forward-thinking team!