Hiring: Director, Package Design Engineering Company: Renesas Electronics Location: San Jose, CA Job Posted Time: 2026-09-10 10:55:47 Employment Type: Contract Target Skills & Keywords : Agile, Assembly, Embedded Systems, R About the job Experience: •15 to 20 years of relevant experience in package development emphasizing power SiP/module, wafer level & flip-chip packaging •20 years of relevant experience in package development emphasizing power SiP/module, wafer level & flip-chip packaging Required Skills: •Package Technology Development/NPI, R&D, Global OSAT management for new Package Development/Product qualification, Technology Roadmap definition, R&D budget management & customer adoption programs. •Benchmark, select and qualify suitable materials, processes and assembly subcontractors (OSAT) or contract manufacturers (CM). •Interface directly with OSAT/CM to develop, run DOE to optimize processes and establish process spec. •Interface directly with Product groups and Reliability team, qualify new packages and processes within required time frame. •Resolve all process integration issues by ensuring all window checks are done on critical process steps. •Establish production controls and monitors to ensure there is no room for quality incidents. •Ensure smooth transition into production & implement ramp up monitor. •Interface directly with OSAT/CM to monitor and resolve process issues early in the production phase to ensure only parts with superior quality shipped to customer. Qualifications: •Doctorate/Masters / Bachelor’s Degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering. •In-depth knowledge of power SiP/modules, wafer level/flip-chip packaging methods, assembly process knowledge, qualification methods, SPC and statistical analysis software •Knowledge of wire-bonding & multi-chip module technologies a plus. •Strong interpersonal and communication skills. •Strong analytical and presentation skills. •The expected annual pay range for this position is $230,000-260,000. This position is also eligible for bonus opportunities. Please note that final offer amount will be dependent on geographic location, applicable experience, and skillset of the candidate. •Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier •. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future. •At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives. •We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process. Compensation: •$230,000 - $260,000 / year •Competitive benefits and rewards package •This position is also eligible for bonus opportunities Interested candidates, please apply directly through the job posting on company's career page or try via AI auto apply on this platform. Don't miss this opportunity to join a forward-thinking team!