Hiring: Director, Manufacturing and Test Engineering Company: Celestica Location: Richardson, TX Job Posted Time: 2026-09-03 10:15:03 Target Skills & Keywords : ASIC, Assembly, PCB About the job Required Skills: •Advanced Process & Equipment Development: Identify, scope, and manage customer-specific process and equipment development projects from concept to full production launch. Break physical and manufacturing barriers to deliver next-generation AI-enabling hardware. •DFX & Collaboration: Partner closely with internal Product Design groups (HPS) and external customers early in the design phase. Evaluate, optimize, and negotiate tradeoffs for Design for Manufacturability (DFM), Assembly (DFA), and Test (DFT) to deliver cost-optimized, flawless manufacturing solutions. •Thermal & Material Innovation Execution: Oversee Subject Matter Experts (SMEs) focused on high-power ASIC thermal modeling, liquid Thermal Interface Materials (TIM) application, signal integrity (CPO/Chip Package Optics), and material science interactions (micro-level pitch spacing, advanced soldering). •System Integration Growth (L11/L12): Drive manufacturing and test strategies tailored for large, complex Level 11 (L11) integration and next-generation rack-level solutions. •Operational Excellence & Urgency: Instill a strong culture of accountability and velocity. Transform development timelines from traditional 12-month cycles down to aggressive 5-to-9-month windows without sacrificing quality or safety. •Global Standards & Succession: Manage the phased talent transition and succession planning for retiring legacy teams. Establish best practice standards, provide global application support, and build out the Greater Dallas engineering hub. •Semiconductor & Advanced Packaging Expertise: Deep understanding of large ASIC packages, silicon thermal dynamics, substrate warpage, coefficient of thermal expansion (CTE), and tight-pitch PCB manufacturing. •Advanced Thermal Management: Familiarity with high-power cooling methodologies, thermal dissipation modeling, and liquid/pre-formed thermal interface materials. Qualifications: •Bachelor’s degree in Mechanical Engineering, Electrical Engineering, Materials Science, Chemical Engineering, or an equivalent combination of education and experience. Interested candidates, please apply directly through the job posting on company's career page or try via AI auto apply on this platform. Don't miss this opportunity to join a forward-thinking team!