Hiring: Die-to-Die (D2D) Applications Engineer Company: Broadcom Location: Fort Collins, CO Job Posted Time: 2026-09-17 01:07:09 Target Skills & Keywords : ASIC, C, C++, Embedded Systems, Firmware, Python, Ruby, Systems Integration, Verilog About the job Experience: •A Bachelor’s Degree in Electrical or Computer Engineering or equivalent, and 5+ years of related experience; or Masters degree and 3+ years of related experience •5+ years of related experience; or Masters degree and 3+ years of related experience Required Skills: •While prior D2D PHY experience is a strong plus, we place equal or greater weight on candidates who are exceptional at root-causing hard problems that span RTL, firmware, and system-level interactions. •Provide hands-on technical support to internal and external customers integrating the D2D PHY IP into their ASIC and products •Debug and resolve Verilog/RTL simulation issues encountered during customer integration •Support internal DFT (Design-for-Test) and ATE (Automated Test Equipment) production test development teams with PHY-specific technical guidance •Assist external customers with silicon bring-up, characterization, and production test/debug support •Triage and resolve firmware-related issues and questions from customers using the PHY’s embedded software/firmware stack •Diagnose issues that span multiple layers — RTL, firmware, and system/software — and identify root cause across hardware/software boundaries •Develop and maintain deep expertise in the architecture, functionality, and operation of the proprietary D2D PHY (hardware and software) Qualifications: •Demonstrated hands-on experience running and debugging Verilog simulations •Strong debugging skills across at least two of the following domains: RTL/digital logic, firmware, embedded software, or system-level hardware •Comfort working at the intersection of hardware and software — able to trace an issue from a software/firmware symptom down to a hardware or RTL root cause (or vice versa) •Solid understanding of digital design fundamentals and standard chip-level interfaces/protocols •Strong communication skills, with the ability to explain complex technical issues clearly to both internal engineering teams and external customers •Self-directed and comfortable owning ambiguous, open-ended debug problems •Scripting skills (Python, Ruby, Tcl) for debug automation and log analysis •Operational familiarity with embedded firmware development or debug (C/C++, register-level debug, on-chip debug tools) •Direct experience with Die-to-Die (D2D) PHY IP, chiplet interconnects, or other high-speed SerDes/PHY IP •Prior experience in an applications engineering, field applications engineering (FAE), or customer-facing technical support role Compensation: •Competitive benefits and rewards package Interested candidates, please apply directly through the job posting on company's career page or try via AI auto apply on this platform. Don't miss this opportunity to join a forward-thinking team!