Hiring: BIM Engineer Company: TSMC Location: Phoenix, AZ Job Posted Time: 2026-09-03 10:26:06 Employment Type: On-site Target Skills & Keywords : Phoenix About the job Experience: •1-3 years of modeling experience, or at least 1 year in semiconductor construction. •3 years of modeling experience, or at least 1 year in semiconductor construction. •At least 1 year in semiconductor construction. Required Skills: •Utilize advanced BIM software tools such as Revit, AutoCAD, Navisworks, and Bluebeam to develop accurate 3D models, manage spatial layouts for new FAB tool design, and manage space allocation for tools. •Conduct field observations to assess construction readiness and verify on-site conditions against 3D federated model. •Assign facility ports to semiconductor tools and ensure tool requirements align with project specifications. •Coordinate effectively between various tool engineering modules, Facility engineers, (ISEP (Integrated Systems Engineering and Planning), IT, and AMHS (Automated Material Handling Systems). •Continuously evaluate and refine design workflows to improve efficiency, reduce design cycle times, and maintain high quality of QAQC. •Participate and support projects across FAB facilities in Taiwan, Japan, Europe, and any future TSMC global FAB expansions ensuring compliance with regional standards and cultural considerations. •Track project progress, identify potential issues, and escalate concerns to the team leader or section manager as needed. •Identify and mitigate risks within the project domain to ensure timely and successful outcomes. Qualifications: •Bachelor’s degree in Science, Civil Engineering, Mechanical Engineering, or a related field is required. •Minimum of 1-3 years of modeling experience, or at least 1 year in semiconductor construction. •Proficiency in auto-programming and Building Information Modeling (BIM) software including Autodesk Revit, AutoCAD, Navisworks, and Bluebeam. •Hands-on experience collaborating with engineers, construction teams, and stakeholders during the design and build phases. •Must be willing and able to travel internationally as required to support global projects. This may include extended international assignments based on project needs. Flexibility to adapt to different time zones, cultures, and work environments is essential. •Strong problem-solving skills, active learning attitude, and positive approach. •Strong interpersonal and communication skills to facilitate collaboration across multidisciplinary teams (e.g., EE, Facility, ISEP, IT, AMHS). •Master’s degree in Architecture, Civil Engineering, Software engineering or Construction Management. •Advanced skills in parametric modeling, clash detection, and project visualization using tools like Navisworks Manage, Dynamo for Revit, or other BIM plug-ins. •Prior experience in semiconductor FAB design, high-tech facility development, or cleanroom environments. Compensation: •Competitive benefits and rewards package •Medical, Dental, and Vision Plans: Choose the options that best fit your and your family’s needs Interested candidates, please apply directly through the job posting on company's career page or try via AI auto apply on this platform. Don't miss this opportunity to join a forward-thinking team!