Hiring: Associate Process Engineer Company: PsiQuantum Location: Milpitas, CA Job Posted Time: 2026-09-13 12:05:22 Employment Type: Full-time / Remote Target Skills & Keywords : Assembly, Phoenix, Python, R About the job Experience: •2+ years of experience applying engineering principles to solve complex opto-mechanical assembly process problems. Required Skills: •Will be responsible for assisting in the module assembly processes and maintenance of typical back-end semiconductor packaging equipment and supporting Process Engineers on the development of key assembly steps leading to R&D and volume system process solutions at PsiQuantum. •This role requires hand-on experiences in packaging, processing and equipment handling, a strong “can do” attitude ensuring high-quality standards and precision in all tasks. Your expertise will contribute to delivering exceptional product solutions to our internal and future external customers. •By working with process engineers; fabricate and assemble electro-optical devices, including die attach, wire-bonding and inspection, with a focus on precision and quality. •Under the guidance of Process Engineers, co- design and co-develop assembly process flow, and build subassemblies for QC sub-systems with electronics and silicon photonics chips on PCBAs for both cryogenic and room temperature vacuum systems. •Lead and manage assembly and testing tools to ensure optimal performance and throughput. •Develop and implement “best practice” to enhance product integrity and operational efficiency. •Partner cross-functionally with cross-functional teams, including engineering and manufacturing, to streamline assembly design and production. •Conduct complex troubleshooting and analysis of assembly equipment to resolve technical issues. Qualifications: •Demonstrated capacity to use data processing tools such as Python and JMP to assist Process Engineers. •Demonstrated ability to support short deadline tasks, and to follow a disciplined work process. Able to work in a fast-paced environment. •Operational familiarity with back-end semiconductor assembly processes, testing methodologies and equipment, including die attach, wire-bonding, visual inspection. •Excellent analytical and problem-solving skills, particularly in high-pressure environments. •Positive attitude and always open to learn new knowledge and operation of new equipment. •Good team worker and bring in positive attitude and always ready to help others. •Associates degree or equivalent experience in engineering, physics, or a related field. •Exposure to photonics sub-assembly with experience in semiconductor packaging and inspection equipment, processes and material system (die attach, wire bonding, optical coupling, flip chip, underfill … etc.). •Familiar with key opto-mechanical packaging and assembly equipment and part supplier base and the quality system. •Excellent written and verbal communication skills; Self-starter. Compensation: •Flexible work environment (work from home / hybrid options) •2+ years of experience applying engineering principles to solve complex opto-mechanical assembly process problems Interested candidates, please apply directly through the job posting on company's career page or try via AI auto apply on this platform. Don't miss this opportunity to join a forward-thinking team!