Hiring: ASIC Package Design Manager Company: Broadcom Location: Fort Collins, CO Job Posted Time: 2026-09-10 13:07:08 Employment Type: Remote Target Skills & Keywords : AI, ASIC, Project Management, R About the job Experience: •12+ years of experience in flip-chip-BGA package design, including high-speed SerDes, with a minimum of 3 years in management Required Skills: •Understand the skill sets and traits of each team member, in order to maximize productivity and retention •Project Management : Create and track project plans for 20+ concurrent designs (scope, schedules, resources) •Organize team & customer activities to keep projects on track •Communicate plans, status, next steps and risks •Create technical methodologies for package design •Steering package technology and design rules, with input from team members •Package-Design lifecycle •How the substrate and package fit into the overall ASIC design and manufacturing flows Qualifications: •Preferred candidates have previous experience managing people and projects •BSEE/MSEE or similar field and 12+ years of experience in flip-chip-BGA package design, including high-speed SerDes, with a minimum of 3 years in management •Knowledge of package-level signal integrity and power integrity, to apply to package designs •Cooperate with our world-wide team (multiple time zones), including co-design with internal team members and external (Vendor) designers •This job requires working on-site at the Broadcom office, 5 days a week. This is not a remote-work position •Occasional travel may be required Compensation: •Competitive benefits and rewards package Interested candidates, please apply directly through the job posting on company's career page or try via AI auto apply on this platform. Don't miss this opportunity to join a forward-thinking team!